Virtual Extrusion Laboratory™ - Side Fed Die Module
The COMPUPLAST® VEL™, Side Fed Die module™ is used for the analysis and design of all types of side fed dies or cross-head dies that are typically used in pipe and cable coating or blow molding industry.
Using either a Control Volume Method (CVM) of mathematical analysis, or a fully 3D Finite Element Method (FEM), this module can provide the user with an accurate prediction of the expected die performance.
The user-friendly, intuitive interface and CVM solution technique allows the user to optimize designs quickly and easily.
The VEL™, Side Fed Die module has been developed with the extrusion process engineer in mind.
Many world class extrusion die manufacturers use the VEL™ Side Fed Die module as a part of their daily design procedures.
Many processors and technical service personnel use this module to study and analyze the effect of resin changes on their process.
The VEL™, Flat Spiral Die module™ Features Summary:
- Intuitive user-friendly graphical interface
- Fast and easy parametric geometry definition
- Material degradation elimination
- Optical defects elimination
- Optical defects elimination
- Residence time analysis
- Special automatic design optimization
- Fast, efficient solvers
- Includes fast CV solvers and also full 3D FEM solver
- Custom report configuration
- HTML report
- Ability to export the results into Excel file
- Powerful post processing